Multilayer ceramic electronic component

ABSTRACT

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of first and second internal electrodes disposed on the dielectric layers to face each other with each of the dielectric layers interposed therebetween; and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein the dielectric layer includes a dielectric ceramic composition including a base material main component represented by z(Ba(1-x)Cax)TiO3-(1-z)BaTi2O5 including a first main component represented by (Ba(1-x)Cax)TiO3 and a second main component represented by BaTi2O5, 0.7≤z≤0.8 and 0≤x&lt;0.1.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of priority to Korean PatentApplication No. 10-2018-0120664 filed on Oct. 10, 2018 in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a multilayer ceramic electroniccomponent, and more particularly, to a high-capacitance multilayerceramic electronic component with excellent reliability.

2. Description of Related Art

In accordance with recent trends for miniaturized, slimmed, andmultifunctional electronic products, there has also been a need for aminiaturized multilayer ceramic capacitor and a multilayer ceramiccapacitor has been mounted with high integration.

A multilayer ceramic capacitor, an electronic component, is installed onthe printed circuit boards (PCB) of various electronic products such asan image display device, e.g., a liquid crystal display (LCD) or aplasma display panel (PDP), a computer, a personal digital assistant(PDA), a portable phone, or the like, serving to charge or dischargeelectricity.

The multilayer ceramic capacitor is capable of being used as a componentof various electronic devices by virtue of the advantage whereby themultilayer ceramic capacitor can be miniaturized, has an ensured highcapacitance, and is easily mounted.

Recently, as an electrical component has drawn attention of industry,there has also been a need for high-reliability and high-capacitancemultilayer ceramic capacitor to be used in a vehicle or an infotainmentsystem.

In particular, as an electronic control system of an internal combustionvehicle and an electric vehicle has been increasingly used, there hasbeen an increasing need for a multilayer ceramic capacitor that iscapable of being used at a high-temperature environment.

SUMMARY

An aspect of the present disclosure may provide a multilayer ceramicelectronic component, in detail, a high-reliability and high-capacitancemultilayer ceramic electronic component.

According to an aspect of the present disclosure, a multilayer ceramicelectronic component may include a ceramic body including dielectriclayers and a plurality of first and second internal electrodes disposedon the dielectric layers to face each other with each of the dielectriclayers interposed therebetween and having a first surface and a secondsurface opposing each other in a first direction, a third surface and afourth surface connected to the first surface and the second surface andopposing each other in a second direction, and a fifth surface and asixth surface connected to the first to fourth surfaces and opposingeach other in a third direction; and first and second externalelectrodes disposed on external surfaces of the ceramic body andelectrically connected to the first and second internal electrodes,wherein the dielectric layer includes a dielectric ceramic compositionincluding a base material main component represented byz(Ba_((1-x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a first main componentrepresented by (Ba_((1-x))Ca_(x))TiO₃ and a second main componentrepresented by BaTi₂O₅, 0.7≤z≤0.8 and 0≤x<0.1.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a schematic diagram of a multilayer ceramic capacitoraccording to an exemplary embodiment in the present disclosure;

FIG. 2 is a schematic diagram of a ceramic body according to anexemplary embodiment in the present disclosure;

FIG. 3 is a cross-sectional view taken along I-I′ of FIG. 1 according toan exemplary embodiment in the present disclosure;

FIG. 4 is an enlarged view of a region B of FIG. 3; and

FIG. 5 is a cross-sectional view taken along I-I′ of FIG. 1 according toanother exemplary embodiment in the present disclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of a multilayer ceramic capacitoraccording to an exemplary embodiment in the present disclosure.

FIG. 2 is a schematic diagram of a ceramic body according to anexemplary embodiment in the present disclosure.

FIG. 3 is a cross-sectional view taken along I-I′ of FIG. 1 according toan exemplary embodiment in the present disclosure.

FIG. 4 is an enlarged view of a region B of FIG. 3.

Referring to FIGS. 1 to 4, a multilayer ceramic electronic component 100according to an exemplary embodiment in the present disclosure mayinclude a ceramic body 110 that includes dielectric layers 111 and aplurality of first and second internal electrodes 121 and 122 disposedon the dielectric layers 111 to face each other with each of thedielectric layers interposed therebetween and has a first surface S1 anda second surface S2 opposing each other in a first direction, a thirdsurface S3 and a fourth surface S4 connected to the first surface S1 andthe second surface S2 and opposing each other in a second direction, afifth surface S5 and a sixth surface S6 connected to the first to fourthsurfaces and opposing each other in a third direction, and first andsecond external electrodes 131 and 132 disposed on external surfaces ofthe ceramic body 110 and are electrically connected to the plurality offirst and second internal electrodes 121 and 122.

Hereinafter, a multilayer ceramic electronic component according to anexemplary embodiment in the present disclosure is described and, inparticular, a multilayer ceramic capacitor is described but themultilayer ceramic electronic component is not limited to the multilayerceramic capacitor.

With regard to a multilayer ceramic capacitor according to an exemplaryembodiment in the present disclosure, a length direction is defined asdirection ‘L’ of FIG. 1, a width direction is defined as direction ‘W’of FIG. 1, and a ‘thickness direction’ is defined as direction ‘T’.Here, the thickness direction may be used in the same concept as adirection in which dielectric layers are stacked, i.e., a stackdirection.

According to an exemplary embodiment in the present disclosure, theceramic body 110 may be shaped like, but is not particularly limited to,a hexahedron as illustrated in the drawings.

The ceramic body 110 may include the first surface S1 and the secondsurface S2 opposing each other in the first direction, the third surfaceS3 and the fourth surface S4 connected to the first surface S1 and thesecond surface S2 and opposing each other in the second direction, andthe fifth surface S5 and the sixth surface S6 connected to the first tofourth surfaces and opposing each other in the third direction.

The first surface S1 and the second surface S2 may be defined assurfaces that face each other in the thickness direction of the ceramicbody 110, i.e., the first direction, the third surface S3 and the fourthsurface S4 may be defined as surfaces that face each other in the lengthdirection of the ceramic body 110, i.e., the second direction, and thefifth surface S5 and the sixth surface S6 may be defined as surfacesthat face each other in the width direction of the ceramic body 110,i.e., the third direction.

One end of the plurality of first and second internal electrodes 121 and122 formed in the ceramic body 110 may be exposed out of the thirdsurface S3 or the fourth surface S4 of the ceramic body.

The internal electrodes 121 and 122 may have different polarities andthe first internal electrode 121 and the second internal electrode 122may be provided in one pair.

One end of the first internal electrode 121 may be exposed out of thethird surface S3 and one end of the second internal electrode 122 may beexposed out of the fourth surface S4.

The other end of the first internal electrode 121 and the secondinternal electrode 122 may be formed at a predetermined interval fromthe fourth surface S4 or the third surface S3, which is described belowin detail.

The first and second external electrodes 131 and 132 may be formed onthe third surface S3 and the fourth surface S4 of the ceramic body andmay be electrically connected to the internal electrodes.

The ceramic body 110 may include an active portion A that facilitatesformation of capacitance of a capacitor, and an upper cover portion C1and a lower cover portion C2 that are respectively formed on upper andlower portions of the active portion as upper and lower margin portions.

The active portion A may be formed by repeatedly stacking the pluralityof first and second internal electrodes 121 and 122 on the dielectriclayers 111.

The upper cover portion C1 and the lower cover portion C2 may have thesame material and configuration as the dielectric layer 111 except thatthe upper and lower cover portions C1 and C2 do not include an internalelectrode.

That is, the upper cover portion C1 and the lower cover portion C2 mayinclude a ceramic material and, for example, may include a bariumtitanate (BaTiO₃)-based ceramic material.

The upper cover portion C1 and the lower cover portion C2 may be formedby stacking a single dielectric layer or two or more dielectric layerson upper and lower surfaces of the active portion A in up and downdirections to basically prevent an internal electrode from being damagedby physical or chemical stress.

The first and second internal electrodes 121 and 122 may be formed of aconductive paste including one or more of material, but is notparticularly limited to, for example, silver (Ag), lead (Pb), platinum(Pt), nickel (Ni), and copper (Cu).

The multilayer ceramic capacitor according to an exemplary embodiment inthe present disclosure may include a first external electrode 131 thatis electrically connected to the first internal electrode 121 and asecond external electrode 132 that is electrically connected to thesecond internal electrode 122.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122 toform capacitance and the second external electrode 132 maybe connectedto a different potential from the first external electrode 131.

The first and second external electrodes 131 and 132 may be disposed onthe third surface S3 and the fourth surface S4, respectively, in thelength direction of the ceramic body 110, i.e., the second directionand, in this case, may extend onto the first surface S1 and the secondsurface S2 in the thickness direction of the ceramic body 110, i.e., thefirst direction.

The external electrodes 131 and 132 may be disposed on an externalsurface of the ceramic body 110 and may include electrode layers 131 aand 132 a that are electrically connected to the internal electrodes 121and 122 and conductive resin layers 131 b and 132 b disposed on theelectrode layers 131 a and 132 a.

The electrode layers 131 a and 132 a may include conductive metal andglass.

The conductive metal used in the electrode layers 131 a and 132 a is notparticularly limited as long as the conductive metal is electricallyconnectable to the internal electrode to form capacitance and, forexample, may include one or more selected from the group consisting ofcopper (Cu), silver (Ag), nickel (Ni), and an alloy thereof. Forexample, the conductive metal may include copper (Cu).

The electrode layers 131 a and 132 a may be formed by coating conductivepaste prepared by adding glass frit to conductive metal powder particlesand then sintering the resultant.

The conductive resin layers 131 b and 132 b may be formed on theelectrode layers 131 a and 132 a to completely cover the electrodelayers 131 a and 132 a.

The conductive resin layers 131 b and 132 b are formed to completelycover the electrode layers 131 a and 132 a and, thus, a distance to anend portion of the conductive resin layers 131 b and 132 b disposed onthe first surface S1 and the second surface S2 of the ceramic body 110is longer than a distance to an end portion of the electrode layers 131a and 132 a disposed on the first surface S1 and the second surface S2of the ceramic body 110.

Base resin included in the conductive resin layers 131 b and 132 b isnot particularly limited as long as the base resin has adhesiveproperties and impact absorbing properties and is mixed with conductivemetal powder particles to form paste and may include, for example,epoxy-based resin.

Conductive metal included in the conductive resin layers 131 b and 132 bis not particularly limited as long as the conductive metal iselectrically connectable to the electrode layers 131 a and 132 a and mayinclude one or more selected from the group consisting of, for example,copper (Cu), silver (Ag), nickel (Ni), and an alloy thereof.

Plating layers 131 c, 132 c, 131 d, and 132 d may be further disposed onthe conductive resin layers 131 b and 132 b.

The plating layers 131 c, 132 c, 131 d, and 132 d may be disposed on theconductive resin layers 131 b and 132 b to completely cover theconductive resin layers 131 b and 132 b.

The plating layers 131 c, 132 c, 131 d, and 132 d may include Ni platinglayers 131 c and 132 c disposed on the conductive resin layers 131 b and132 b and Pd plating layers 131 d and 132 d disposed on the Ni platinglayers 131 c and 132 c.

According to an exemplary embodiment in the present disclosure, thedielectric layer 111 may include dielectric ceramic compositionincluding a base material main component represented byz(Ba_((1-x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a first main componentrepresented by (Ba_(1-x))Ca_(x))TiO₃ and a second main componentrepresented by BaTi₂O₅, 0.7≤z≤0.8 and 0≤x≤0.1.

Recently, as an electrical component has drawn attention of the field,there has also been a need for high-reliability and high-capacitancemultilayer ceramic capacitor to be used in a vehicle or an infotainmentsystem.

In particular, as an electronic control system of an internal combustionvehicle and an electric vehicle has been increasingly used, there hasbeen an increasing need for a multilayer ceramic capacitor that iscapable of being used at a high-temperature environment.

Currently, a main dielectric material of a high-capacitance multilayerceramic capacitor is barium titanate (BaTiO₃) and, in this regard, aceramic body needs to be sintered in a reduction condition while using aNi internal electrode and, thus, the dielectric material requiresnon-reduction property.

However, as capacitance is largely reduced in an environment of 150° C.or greater due to the unique property of barium titanate (BaTiO₃) oxide,there is a problem in that it is difficult to ensure electricalproperties depending on temperature, which is required by an electricalproduct.

In addition, there is a need for a multilayer ceramic capacitor that isavailable in a high-temperature environment, which is a situation inwhich it is almost impossible to extensively use the multilayer ceramiccapacitor up to 200° C., by applying a new composition.

According to an exemplary embodiment in the present disclosure, thedielectric layer 111 may include two types of main components of a firstmain component represented by (Ba_((1-x))Ca_(x))TiO₃ and a second maincomponent represented by BaTi₂O₅ and, in this regard, contents of therespective components may be adjusted to stably ensure ahigh-temperature capacitance variation rate and, simultaneously, toembody a high-capacitance multilayer ceramic capacitor.

In detail, the dielectric layer 111 may include a dielectric ceramiccomposition including a base material main component represented byz(Ba_((1-x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a first main componentrepresented by (Ba_((1 x))Ca_(x))TiO₃ and a second main componentrepresented by BaTi₂O₅, 0.7≤z≤0.8 and 0≤x≤0.1 to stably ensure ahigh-temperature capacitance variation rate and, simultaneously, toembody a high-capacitance multilayer ceramic capacitor.

Hereinafter, each component of a dielectric ceramic composition includedin a dielectric layer according to an exemplary embodiment in thepresent disclosure is described in more detail.

a) Base Material Powder Particles

According to an exemplary embodiment in the present disclosure, thedielectric layer 111 may include a base material main componentrepresented by z(Ba_((1 x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a firstmain component represented by (Ba_((1-x))Ca_(x))TiO₃ and a second maincomponent represented by BaTi₂O₅.

The base material main component may be included in the form of powderparticles and the first main component as first base material powderparticles and the second main component as second base material powderparticles may be included in the dielectric ceramic composition.

In the above expression, z satisfies 0.7≤z≤0.8 and x satisfies 0≤x<0.1.

The first main component may be represented by (Ba_((1-x))Ca_(x))TiO₃and the BCT material may be a ferroelectric material as a material usedas a general dielectric base material.

The second main component may be represented by BaTi₂O₅.

BaTi₂O₅ that is the second main component may have high ferroelectrictransition temperature compared with (Ba_((1-x))Ca_(x))TiO₃ that is thefirst main component.

Accordingly, when BaTi₂O₅ that is the second main component is used as amain component or is used alone, a high-temperature capacitancevariation rate may be stably ensured due to high ferroelectrictransition temperature characteristics.

However, when BaTi₂O₅ is used as a main component or is used alone, anexcessively large amount of titanium (Ti) is present compared withBaTiO₃ in the prior art and, thus, there is a problem in that titanium(Ti) reacts with nickel (Ni) included in the internal electrode andnickel (Ni) is diffused into the dielectric layer.

Accordingly, there is a problem in that a dielectric constant of amultilayer ceramic capacitor is lowered.

That is, when (Ba_((1-x))Ca_(x))TiO₃ that is the first main component isused alone, there is a problem in that it is possible to embody ahigh-capacitance multilayer ceramic capacitor but a high-capacitancevariation rate is not stably ensured due to a high dielectric constant.

When BaTi₂O₅ that is the second main component is used as a maincomponent or is used alone, there is a problem in that ahigh-temperature capacitance variation rate is stably ensured but adielectric constant is lowered due to high ferroelectric transitiontemperature properties.

Accordingly, to stably ensure a high-temperature capacitance variationrate and, simultaneously, to embody a high-capacitance multilayerceramic capacitor, according to an exemplary embodiment in the presentdisclosure, the dielectric layer 111 may include two types of maincomponents of a first main component represented by(Ba_((1-x))Ca_(x))TiO₃ and a second main component represented byBaTi₂O₅ and, contents of these components may be adjusted.

In detail, z may be adjusted to satisfy 0.7≤z≤0.8 and, thus, 70 mol % to80 mol % of (Ba_((1 x))Ca_(x))TiO₃ as the first main component based on100 mol % of a base material main component and the other 20 mol % to 30mol % of BaTi₂O₅ as the second main component may be included in thebase material main component.

When z is less than 0.7, a content of (Ba_((1-x))Ca_(x))TiO₃ as thefirst main component is low and, thus, there is a problem in that it isdifficult to embody a high-capacitance multilayer ceramic capacitor.

On the other hand, when z is greater than 0.8, a content of(Ba_((1-x))Ca_(x))TiO₃ as the first main component is high and a contentof BaTi₂O₅ as the second main component is relatively low and, thus, itis difficult to stably ensure a high-temperature capacitance variationrate.

z may be adjusted to satisfy 0.7≤z≤0.8 to stably ensure ahigh-temperature capacitance variation rate and, simultaneously, toembody a high-capacitance multilayer ceramic capacitor.

The first main component may be represented by (Ba_((1-x))Ca_(x))TiO₃and x may satisfy 0≤x<0.1.

That is, calcium (Ca) with a content less than 10 mol % and including 0mol % may be included in the first main component.

In detail, calcium (Ca) with a content equal to or less than 7 mol % andincluding 0 mol % may be included in the first main component and, thus,0≤x≤0.7 may be satisfied.

x may be equal to or greater than 0 and, when x is 0, the first maincomponent may be BaTiO₃.

The base material main component of the dielectric ceramic compositionmay be formed in a solid solution formed by solidifying the first maincomponent and the second main component.

When the base material powder particles are solidified with each other,the base material powder particles may be a single phase and, in thiscase, a high-temperature capacitance variation rate, a dielectricconstant, and so on may be excellent compared with the case in which twomaterials are mixed.

An average particle diameter of the first base material powder particlesas the first main component and the second base material powderparticles as the second main component may be equal to or less than 200nm but is not limited thereto.

The base material main component powder particles may have, but is notparticularly limited to, an average particle diameter of powderparticles of 150 nm or less.

b) First Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric ceramic composition may further include an oxide or carbonateincluding at least one of manganese (Mn), vanadium (V), chromium (Cr),iron (Fe), nickel (Ni), cobalt (Co), copper (Cu), and zinc (Zn) as thefirst accessory component.

An oxide or carbonate including at least one of manganese (Mn), vanadium(V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper (Cu),and zinc (Zn) as the first accessory component may be included in acontent of 0.1 to 2.0 mol % based on 100 mol % of the base materialpowder.

The first accessory component may degrade sintering temperature of amultilayer ceramic capacitor with dielectric ceramic composition appliedthereto and may enhance the high-temperature withstanding-voltagecharacteristics of the multilayer ceramic capacitor.

A content of the first accessory component and a content of a secondaccessory component to be described below may be defined as an includedamount based on 100 mol % of the base material powder, in particular,mol % of metallic ions included in each accessory component.

When a content of the first accessory component is less than 0.1 mol %,sintering temperature may be increased and high-temperaturewithstanding-voltage characteristics may be slightly degraded.

When a content of the first accessory component is equal to or greaterthan 2.0 mol %, high-temperature withstanding-voltage characteristicsand room-temperature resistivity may be degraded.

In particular, the dielectric ceramic composition according to anexemplary embodiment in the present disclosure may further include afirst accessory component with a content of 0.1 to 2.0 mol % based on100 mol % of the base material powder and, thus, it may be possible tosinter the ceramic composition at low temperature and excellenthigh-temperature withstanding-voltage characteristics may be achieved.

c) Second Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric ceramic composition may include an oxide including silicon(Si) or a glass compound including Si as the second accessory component.

The dielectric ceramic composition may further include 0.2 to 5.0 mol %of the second accessory component as an oxide including Si or a glasscompound including Si based on 100 mol % of the base material powderparticles.

The second accessory component may degrade sintering temperature of amultilayer ceramic capacitor with dielectric ceramic composition appliedthereto and may enhance high-temperature withstanding-voltagecharacteristics.

When a content of the second accessory component is less than 0.2 mol %based on 100 mol % of the base material powder, sintering temperaturemay be increased.

When a content of the second accessory component is equal to or greaterthan 5.0 mol % based on 100 mol % of the base material powder,high-temperature withstanding-voltage characteristics may be degraded.

In particular, the dielectric ceramic composition according to anexemplary embodiment in the present disclosure may further include asecond accessory component with a content of 0.2 to 5.0 mol % based on100 mol % of the base material powder and, thus, it may be possible tosinter the dielectric ceramic composition at low temperature andexcellent high-temperature withstanding-voltage characteristics may beachieved.

d) Third Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric ceramic composition may further include a third accessorycomponent as an oxide, carbonate, or fluoride including lithium (Li).

The dielectric ceramic composition may further include 0.4 to 12.0 mol %of the third accessory component as an oxide, carbonate, or fluorideincluding lithium (Li) based on 100 mol % of the base material powder.

The third accessory component may degrade sintering temperature of amultilayer ceramic capacitor with dielectric ceramic composition appliedthereto and may enhance high-temperature withstanding-voltagecharacteristics.

When copper (Cu) is used to form an internal electrode, the thirdaccessory component may also achieve target characteristics of themultilayer ceramic capacitor.

When a content of the third accessory component is less than 0.4 mol %based on 100 mol % of the base material powder, sintering temperaturemay be increased, a dielectric constant may be lowered, andhigh-temperature withstanding-voltage characteristics may be degraded.

When a content of the third accessory component is equal to or greaterthan 12.0 mol % based on 100 mol % of the base material powder,high-temperature withstanding-voltage characteristics may be degradeddue to generation of a secondary phase or the like.

In particular, the dielectric ceramic composition according to anexemplary embodiment in the present disclosure may further include athird accessory component with a content of 0.4 to 12.0 mol % based on100 mol % of the base material powder 100 and, thus, copper (Cu) may beused to form an internal electrode, it may be possible to sinter thedielectric ceramic composition at low temperature, and excellenthigh-temperature withstanding-voltage characteristics may be achieved.

e) Fourth Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric ceramic composition may further include a fourth accessorycomponent that is an oxide, carbonate, or fluoride including barium(Ba).

The dielectric ceramic composition may further include 0 to 3.0 at % ofthe fourth accessory component based on at % of barium (Ba), as anoxide, carbonate, or fluoride including barium (Ba), with respect to 100wt % of the base material powder.

The fourth accessory component may enhance a dielectric constant of themultilayer ceramic capacitor with the dielectric ceramic compositionapplied thereto.

When copper (Cu) is used to form an internal electrode and is sinteredin a reduction condition (N₂ atmosphere), the fourth accessory componentmay also achieve the target characteristics of the multilayer ceramiccapacitor.

When a content of the fourth accessory component is greater than 3.0 at% based on at % of barium (Ba) with respect to 100 mol % of the basematerial powder, high-temperature withstanding-voltage characteristicsmay be degraded.

In particular, the dielectric ceramic composition according to anexemplary embodiment in the present disclosure may further include 0 to3.0 at % of the fourth accessory component based on at % of barium (Ba),as an oxide, carbonate, or fluoride including barium (Ba), with respectto 100 wt % of the base material powder and, thus, copper (Cu) may beused to form an internal electrode, it may be possible to sinter thedielectric ceramic composition in a reduction condition, and a highdielectric constant and excellent high-temperature withstanding-voltagecharacteristics may be achieved.

The fourth accessory component according to an exemplary embodiment inthe present disclosure may include barium (Ba) to satisfy a molar ratioof Ba/Si of 0 to 4.0.

A molar ratio of the second accessory component including an oxideincluding Si or a glass compound including Si and the fourth accessorycomponent may be adjusted to satisfy 0 to 4.0 to achieve a highdielectric constant and, simultaneously, to achieve excellenthigh-temperature withstanding-voltage characteristics.

In detail, when a content of barium (Ba) of the fourth accessorycomponent as an oxide, carbonate, or fluoride including barium (Ba) isgreater than 3.0 at %, a content of silicon (Si) as the second accessorycomponent may also be adjusted to satisfy a molar ratio of Ba/Si of 4.0and, thus, high-temperature withstanding-voltage characteristics mayalso be enhanced.

However, when a molar ratio of Ba/Si is greater than 4.0, withstandingvoltage characteristics may be degraded and a problem may arise in termsof reliability.

f) Fifth Accessory Component

According to an exemplary embodiment in the present disclosure, thedielectric ceramic composition may further include a fifth accessorycomponent as an oxide, carbonate, or fluoride including at least one ofdysprosium (Dy), yttrium (Y), holmium (Ho), samarium (Sm), gadolinium(Gd), erbium (Er), lanthanum (La), and terbium (Tb).

The dielectric ceramic composition may further include the fifthaccessory component with a content of 0 to 4.0 at % based on at % ofeach component, as an oxide, carbonate, fluoride including at least oneof dysprosium (Dy), yttrium (Y), holmium (Ho), samarium (Sm), gadolinium(Gd), erbium (Er), lanthanum (La), and terbium (Tb), with respect to 100mol % of the base material powder.

The fifth accessory component may enhance the DC-bias characteristics ofa multilayer ceramic capacitor with dielectric ceramic compositionapplied thereto and enhance high-temperature withstanding voltage,thereby enhancing reliability.

When a content of the fifth accessory component is greater than 4.0 at %based on at % of each component with respect to 100 mol % of the basematerial powder, a room-temperature dielectric constant may be reducedand, thus, it may not be possible to achieve target characteristics.

In particular, the dielectric ceramic composition according to anexemplary embodiment in the present disclosure may further include thefifth accessory component with a content of 0 to 4.0 at % based on at %of each component, as an oxide, carbonate, or fluoride including atleast one of dysprosium (Dy), yttrium (Y), holmium (Ho), samarium (Sm),gadolinium (Gd), erbium (Er), lanthanum (La), and terbium (Tb) withrespect to 100 mol % of the base material powder and, thus, DC-biascharacteristics may be enhanced and high-temperature withstandingvoltage may be increased, thereby enhancing reliability.

Referring to FIG. 4, a thickness t3 of a region of the dielectric layer111, in which a content of nickel (Ni) is equal to or less than 3 wt %,from a boundary of each of the first and second internal electrodes 121and 122 and a thickness t2 of each of the first and second internalelectrodes 121 and 122 may satisfy t2>t3.

According to an exemplary embodiment in the present disclosure, thedielectric layer 111 may include two types of main components of a firstmain component represented by (Ba_((1-x))Ca_(x))TiO₃ and a second maincomponent represented by BaTi₂O₅ and, thus, the thickness t3 of theregion of the dielectric layer 111, in which a content of nickel (Ni) isequal to or less than 3 wt %, may be smaller than the thickness t2 ofthe first and second internal electrodes 121 and 122.

As such, a problem in that nickel (Ni) is diffused into the dielectriclayer may be minimized and, thus, a dielectric constant may be preventedfrom being lowered to embody a high-capacitance multilayer ceramiccapacitor.

On the other hand, to stably ensure a high-temperature capacitancevariation rate, when BaTi₂O₅ is used as a main component or is usedalone, the thickness t3 of a region of the dielectric layer, in which acontent of nickel (Ni) is equal to or less than 3 wt %, may be greaterthan the thickness t2 of the first and second internal electrodes.

In this case, there is a problem in that a dielectric constant of amultilayer ceramic capacitor is lowered.

Referring to FIG. 4, in the multilayer ceramic electronic componentaccording to an exemplary embodiment in the present disclosure, athickness t1 of the dielectric layer 111 and the thickness t2 of theinternal electrodes 121 and 122 may satisfy t1>2×t2.

That is, according to an exemplary embodiment in the present disclosure,the thickness t1 of the dielectric layer 111 may be twice greater thanthe thickness t2 of the internal electrodes 121 and 122.

In general, a high-voltage electrical electronic component has a problemin terms of reliability as an important issue due to degradation of adielectric breakdown voltage in a high-voltage environment.

The multilayer ceramic capacitor according to an exemplary embodiment inthe present disclosure may be configured in such a way that thethickness t1 of the dielectric layer 111 is twice greater than thethickness t2 of the internal electrodes 121 and 122 to prevent adielectric breakdown voltage from being degraded in a high-voltageenvironment to increase a thickness of a dielectric layer as a clearancebetween internal electrode, thereby enhancing dielectric breakdownvoltage characteristics.

When the thickness t1 of the dielectric layer 111 is twice or less thanthe thickness t2 of the internal electrodes 121 and 122, the thicknessof the dielectric layer as a clearance between internal electrodes issmall, thereby lowering a dielectric breakdown voltage.

The thickness t2 of the internal electrode may be less than 2 μm and athickness td of the dielectric layer may be less than 10.0 μm but thepresent disclosure is not limited thereto.

FIG. 5 is a cross-sectional view taken along I-I′ of FIG. 1 according toanother exemplary embodiment in the present disclosure.

Referring to FIG. 5, the multilayer ceramic capacitor according toanother exemplary embodiment in the present disclosure may furtherinclude a plurality of floating electrodes 123 that are alternatelydisposed with respect to first and second internal electrodes 121′ and122′ in the thickness direction in the ceramic body 110 and haveopposite end portions that overlap with predetermined portions of thefirst and second internal electrodes 121′ and 122′.

The first and second internal electrodes 121′ and 122′ may havedifferent polarities, may be simultaneously formed on at least onesurface of a ceramic sheet for forming the dielectric layer 111 to bespaced apart from each other, and may be respectively exposed throughopposite end surfaces of the ceramic body 110 in the ceramic body 110.

As such, the first and second internal electrodes 121′ and 122′ that areexposed through the opposite end surfaces of the ceramic body 110 may beelectrically connected to the first and second external electrodes 131and 132, respectively.

The plurality of floating electrodes 123 may be alternately disposedwith respect to the first and second internal electrodes 121′ and 122′in the thickness direction in the ceramic body 110 and may have oppositeend portions that partially overlap with end portions of the first andsecond internal electrodes 121′ and 122′, which are spaced apart fromeach other.

The plurality of floating electrodes 123 may be configured in such a waythat a distance spaced apart from the opposite end surfaces of theceramic body 110 is equal to or greater than 5% of an entire length ofthe ceramic body 110.

According to another exemplary embodiment in the present disclosure,first and second dummy electrodes 124 a and 124 b may be disposed to bespaced apart from each other in the upper cover portion C1 and the lowercover portion C2 that are disposed on upper and lower surfaces of theactive portion A, respectively.

The first dummy electrode 124 a may be exposed through the same surfaceas an outer lateral surface of the ceramic body 110, through which thefirst internal electrode 121′ is exposed, and the second dummy electrode124 b may be exposed through the same surface as an outer lateralsurface of the ceramic body 110, through which the second internalelectrode 122′ is exposed.

The first dummy electrode 124 a may be exposed through the same surfaceas an outer lateral surface of the ceramic body 110, through which thefirst internal electrode 121′ is exposed, and the second dummy electrode124 b may be exposed through the same surface as an outer lateralsurface of the ceramic body 110, through which the second internalelectrode 122′ is exposed, thereby enhancing the flexural rigidity ofthe multilayer ceramic capacitor.

Hereinafter, a method of manufacturing a multilayer ceramic electroniccomponent according to an exemplary embodiment in the present disclosureis described but is not limited thereto.

In the method of manufacturing the multilayer ceramic electroniccomponent according to an exemplary embodiment in the presentdisclosure, a slurry, which is formed by adding a dielectric ceramiccomposition including a base material main component represented byz(Ba_((1-x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a first main componentrepresented by (Ba_((1-x))Ca_(x))TiO₃ and a second main componentrepresented by BaTi₂O₅ in which z satisfies 0.7≤z≤0.8 and x satisfies0≤x≤0.1, may be coated and dried on a carrier film to prepare aplurality of ceramic green sheets, thereby forming a dielectric layer.

The ceramic green sheet may be manufactured in the form of a sheet witha thickness of several μm by mixing ceramic powder particles, binders,and solvents to prepare slurry and performing a doctor blade method onthe slurry.

Then, an average particle size of nickel (Ni) may be 0.1 to 0.2 μm andconductive paste for an internal electrode including nickel (Ni) powderparticles with 40 to 50 parts by weight may be prepared.

The conductive paste for the internal electrode may be coated on thegreen sheet using a screen printing method to form the internalelectrode and, then, green sheets on which an internal electrode patternis disposed may be stacked to prepare the ceramic body 110.

Then, an electrode layer including conductive metal and glass includingone or more selected from the group consisting of copper (Cu), silver(Ag), nickel (Ni), and an alloy thereof may be formed on an externalsurface of the ceramic body.

The glass is not particularly limited and may be a material with thesame composition as glass used to manufacture an external electrode of ageneral multilayer ceramic capacitor.

The electrode layer may be formed on upper and lower surfaces and an endportion of the ceramic body and, thus, may be electrically connected tothe first and second internal electrodes.

The electrode layer may include 5 vol % of glass based on conductivemetal.

Then, conductive resin composition may be coated and, then, hardened onthe electrode layers 131 a and 132 a to form the conductive resin layers131 b and 132 b.

The conductive resin layers 131 b and 132 b may include conductive metaland base resin including one or more selected from the group consistingof copper (Cu), silver (Ag), nickel (Ni), and an alloy thereof and thebase resin may be epoxy resin.

Then, the Ni plating layers 131 c and 132 c may be formed on theconductive resin layers 131 b and 132 b and the Pd plating layers 131 dand 132 d may be formed on the Ni plating layers 131 c and 132 c.

Table 1 below shows a measurement result of a dielectric constant,resistivity, and a high-temperature capacitance variation rate (ΔCp @200° C.) depending on z and x in a base material main componentrepresented by z(Ba_((1-x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a firstmain component represented by (Ba_((1-x))Ca_(x))TiO₃ and a second maincomponent represented by BaTi₂O₅, which are included in a dielectricceramic composition.

The cases in which a dielectric constant is equal to or greater than 800are determined to be satisfactory as Inventive Examples and the case inwhich a dielectric constant is less than 800 are determined to be pooras Comparative Examples.

The cases in which resistivity is equal to or greater than 1.0e10 Ωcmare determined to be satisfactory as Inventive Examples and the cases inwhich resistivity is less than 1.0e10 Ωcm are determined to be poor asComparative Examples.

The cases in which a high-temperature capacitance variation rate (ΔCp @200° C.) at temperature of 200° C. is equal to less than −15% aredetermined to be satisfactory as Inventive Examples and the cases inwhich the high-temperature capacitance variation rate (ΔCp @ 200° C.) attemperature of 200° C. is greater than −15% are determined to be poor asComparative Examples.

TABLE 1 dielectric resistivity z x constant (Ωcm) ΔCp @ 200° C. *1 0.6 0630 7.63e9 −3.6% *2 0.6 0.05 596 7.21e9 −2.9% *3 0.6 0.07 577 6.57e9−2.3% *4 0.6 0.10 546 4.13e9 −0.6% 5 0.7 0 882 1.21e10 −6.6% 6 0.7 0.05847 1.13e10 −5.2% 7 0.7 0.07 811 1.08e10 −4.5% *8 0.7 0.10 780 8.98e9−2.9% 9 0.8 0 1320 2.37e10 −14.3% 10 0.8 0.05 1252 2.14e10 −12.1% 11 0.80.07 1208 1.98e10 −11.3% *12 0.9 0 1624 3.45e10 −25.1% *13 0.9 0.10 14891.88e10 −19.6% *Comparative Example

As seen from Table 1 above, Samples 1 to 4 as Comparative Examplescorrespond to the cases in which z is 0.6 and, in this case, adielectric constant and a resistivity value are lower than a targetvalue according to the present disclosure.

On the other hand, it may be seen that Samples 5 to 7 and 9 to 11 asInventive Examples correspond to the cases in which z and x satisfy anumerical range according to the present disclosure and, in this case,all of a dielectric constant, resistivity, and high-temperaturecapacitance variation rate are satisfactory.

It may be seen that, Sample 8 as Comparative Example corresponds to thecase in which x is 10 and, in this case, a dielectric constant and aresistivity value are lower than a target value according to the presentdisclosure.

It may be seen that, Samples 12 and 13 as other Comparative Examplescorrespond to the case in which z is 0.9 and, in this case, there is aproblem in that a dielectric constant and a resistivity value are higherthan a target value but a high-temperature capacitance variation rate ishigher than a target value according to the present disclosure.

As set forth above, according to an exemplary embodiment in the presentdisclosure, a dielectric layer includes two types of main components ofa first main component represented by (Ba_((1 x))Ca_(x))TiO₃ and asecond main component represented by BaTi₂O₅ and, in this case, contentsof each component may be adjusted to stably ensure a high-temperaturecapacitance variation rate and, simultaneously, to embody ahigh-capacitance multilayer ceramic capacitor.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic electronic componentcomprising: a ceramic body including dielectric layers and a pluralityof first and second internal electrodes disposed on the dielectriclayers and having a first surface and a second surface opposing eachother in a first direction, a third surface and a fourth surfaceconnected to the first surface and the second surface and opposing eachother in a second direction, and a fifth surface and a sixth surfaceconnected to the first to fourth surfaces and opposing each other in athird direction; and first and second external electrodes disposed onexternal surfaces of the ceramic body and electrically connected to thefirst and second internal electrodes, respectively, wherein thedielectric layer includes a dielectric ceramic composition including abase material main component represented byz(Ba_((1-x))Ca_(x))TiO₃-(1-z)BaTi₂O₅ including a first main componentrepresented by (Ba_((1-x))Ca_(x))TiO₃ and a second main componentrepresented by BaTi₂O₅, 0.7≤z≤0.8 and 0≤x<0.1.
 2. The multilayer ceramicelectronic component of claim 1, wherein 0≤x≤0.07.
 3. The multilayerceramic electronic component of claim 1, wherein a thickness of thedielectric layer is less than 10.0 μm.
 4. The multilayer ceramicelectronic component of claim 1, wherein a thickness of the first andsecond internal electrodes is less than 2.0 μm.
 5. The multilayerceramic electronic component of claim 1, wherein t1>2×t2, where t1 is athickness of the dielectric layer and t2 is a thickness of the first andsecond internal electrodes.
 6. The multilayer ceramic electroniccomponent of claim 1, wherein t2>t3, where t3 is a thickness of a regionof the dielectric layer in which a content of nickel (Ni) is equal to orless than 3 wt % from a boundary of each of the first and secondinternal electrodes and t2 is a thickness of each of the first andsecond internal electrodes.
 7. The multilayer ceramic electroniccomponent of claim 1, further comprising a plurality of floatingelectrodes that are alternately disposed with respect to the first andsecond internal electrodes in a thickness direction in the ceramic bodyand have first end portions that overlap with portions of the firstinternal electrodes, and second end portions that overlap with portionsof the second internal electrodes.
 8. The multilayer ceramic electroniccomponent of claim 1, wherein the ceramic body includes an activeportion including the plurality of first and second internal electrodesand cover portions formed on upper and lower surfaces of the activeportion, respectively.
 9. The multilayer ceramic electronic component ofclaim 8, further comprising first and second dummy electrodes disposedto be spaced apart from each other in the cover portions.
 10. Themultilayer ceramic electronic component of claim 9, wherein the firstdummy electrode is exposed through the same surface as a surface of theceramic body through which the first internal electrode is exposed, andthe second dummy electrode is exposed through the same surface as asurface of the ceramic body through which the second internal electrodeis exposed.
 11. The multilayer ceramic electronic component of claim 1,wherein the first and second external electrodes comprise an electrodelayer, a conductive resin layer disposed on the electrode layer, and aplating layer disposed on the conductive resin layer.
 12. The multilayerceramic electronic component of claim 11, wherein the electrode layerincludes glass and copper (Cu).
 13. The multilayer ceramic electroniccomponent of claim 1, wherein the plating layer comprises a firstplating layer including nickel (Ni), and a second plating layerincluding palladium (Pd).
 14. The multilayer ceramic electroniccomponent of claim 1, wherein the first and second internal electrodesface each other with each of the dielectric layers interposedtherebetween.
 15. A dielectric ceramic composition, comprising: a basematerial main component represented byz(Ba_((1 x))Ca_(x))TiO₃-(1-z)BaTi₂O₅, including a first main componentrepresented by (Ba_((1-x))Ca_(x))TiO₃ and a second main componentrepresented by BaTi₂O₅, 0.7≤z≤0.8 and 0≤x<0.1.
 16. The dielectricceramic composition of claim 12, wherein 0≤x≤0.07.
 17. The dielectricceramic composition of claim 12, further comprising at least oneselected from the group consisting of an oxide and a carbonate includingat least one selected from the group consisting of manganese (Mn),vanadium (V), chromium (Cr), iron (Fe), nickel (Ni), cobalt (Co), copper(Cu), and zinc (Zn).
 18. The dielectric ceramic composition of claim 12,further comprising at least one selected from the group consisting of anoxide including silicon (Si) and a glass compound including Si.
 19. Thedielectric ceramic composition of claim 12, further comprising at leastone selected from the group consisting of an oxide, a carbonate and afluoride including lithium (Li), and at least one selected from thegroup consisting of an oxide, a carbonate and a fluoride includingbarium (Ba).
 20. The dielectric ceramic composition of claim 12, furthercomprising at least one selected from the group consisting of an oxide,a carbonate and a fluoride including at least one selected from thegroup consisting of an oxide, carbonate, or fluoride including at leastone of dysprosium (Dy), yttrium (Y), holmium (Ho), samarium (Sm),gadolinium (Gd), erbium (Er), lanthanum (La), and terbium (Tb).